72V3670L6PFG8
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 128-LQFP |
| Supplier Device Package | 128-TQFP (14x20) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tape & Reel (TR) |
| Series | 72V |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.15V~3.45V |
| Base Part Number | 72V3670 |
| Function | Synchronous |
| Current - Supply (Max) | 40mA |
| Memory Size | 288K 8K x 36 |
| Access Time | 4ns |
| Data Rate | 166MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72V3670L6PFG8 Overview
The 128-LQFP package contains FIFO memory chip.Tape & Reel (TR) case is used for packaging.Data and applications can be stored in the FIFO chip's 288K 8K x 36 memory.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .It is mounted in the Surface Mount position.Powered by a voltage of 3.15V~3.45V , it operates on a low supply voltage.A component in the 72V series, this is an memory logic.Memory IC's maximum operating supply current is 40mA .The 72V3670 family of objects contains it.
72V3670L6PFG8 Features
288K 8K x 36 memory size
72V series
Best part number of 72V3670
72V3670L6PFG8 Applications
There are a lot of Renesas Electronics America Inc. 72V3670L6PFG8 FIFOs Memory applications.
- Disk Controllers
- Switches
- PC peripheral
- Seismic Data Collection at Extreme Temperatures
- Wireless
- General Data Collection Applications at Extreme High-Temperatures
- Down-Hole Energy Drilling
- Notebook
- Signal processing
- Multi-stage synchronizer