| Parameters |
| Factory Lead Time |
12 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
324-BGA |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Series |
72T |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Voltage - Supply |
2.375V~2.625V |
| Base Part Number |
72T7295 |
| Function |
Asynchronous, Synchronous |
| Current - Supply (Max) |
130mA |
| Memory Size |
2.25M 32K x 72 |
| Access Time |
10ns, 3.6ns |
| Data Rate |
83MHz, 200MHz |
| Bus Directional |
Uni-Directional |
| FWFT Support |
Yes |
| Expansion Type |
Depth, Width |
| RoHS Status |
Non-RoHS Compliant |
72T7295L5BB Overview
324-BGA is the package in which FIFO memory chip is contained.Tray case is used for packaging.The FIFO chips have a memory of 2.25M 32K x 72 that can be used to store applications and data.Regulating the temperature to 0°C~70°C ensures reliable operation.It is mounted in the Surface Mount position.Operating voltage is 2.375V~2.625V .A component in the 72T series, this is an memory logic.There is a maximum operating current of 130mA in memory IC's supply.A member of the 72T7295 family, it has the following characteristics.
72T7295L5BB Features
2.25M 32K x 72 memory size
72T series
Best part number of 72T7295
72T7295L5BB Applications
There are a lot of Renesas Electronics America Inc. 72T7295L5BB FIFOs Memory applications.
- Extended product life cycle
- MP3 Interface for Automobile
- Data
- General Data Collection Applications at Extreme High-Temperatures
- Switches
- Consumer Systems
- Communications Systems
- Application that requires re-writable nonvolatile parameter memory
- Product traceability
- Network switching/routing