72T7295L10BB
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 324-BGA |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | 72T |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.375V~2.625V |
| Base Part Number | 72T7295 |
| Function | Asynchronous, Synchronous |
| Current - Supply (Max) | 130mA |
| Memory Size | 2.25M 32K x 72 |
| Access Time | 14ns, 4.5ns |
| Data Rate | 50MHz, 100MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
72T7295L10BB Overview
324-BGA is a package that contains FIFO memory chip.It comes in a Tray package.There is a memory of 2.25M 32K x 72 available for storing data and applications.It is advisable to regulate the temperature to 0°C~70°C to ensure reliable operation.The FIFO memory's mounting type is Surface Mount .Operating voltage is 2.375V~2.625V .It is a member of the 72T series .130mA is the FIFO's maximum operating supply current.Memory IC is a member of the 72T7295 family.
72T7295L10BB Features
2.25M 32K x 72 memory size
72T series
Best part number of 72T7295
72T7295L10BB Applications
There are a lot of Renesas Electronics America Inc. 72T7295L10BB FIFOs Memory applications.
- SPI Bus Flash Memory Devices
- High-speed disk
- General Data Collection Applications at Low-Temperatures
- Multi-stage synchronizer
- SPI Bus Flash Memory Device
- Communications
- Data communications
- Wireless
- Computer networks
- Telecommunication