| Parameters |
| Mounting Type |
Surface Mount |
| Package / Case |
208-BGA |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Series |
72T |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Voltage - Supply |
2.375V~2.625V |
| Base Part Number |
72T3685 |
| Function |
Asynchronous, Synchronous |
| Current - Supply (Max) |
70mA |
| Memory Size |
576K 16K x 36 |
| Access Time |
12ns, 3.8ns |
| Data Rate |
66MHz, 150MHz |
| Bus Directional |
Uni-Directional |
| FWFT Support |
Yes |
| Expansion Type |
Depth, Width |
| RoHS Status |
Non-RoHS Compliant |
72T3685L6-7BB Overview
FIFO memory chip can be found in the 208-BGA package.There's a Tray on the package.There is a memory of 576K 16K x 36 available for storing data and applications.It is recommended that the temperature be kept at 0°C~70°C to ensure reliable operation.It is a Surface Mount mounting type FIFO memory.This FIFO products operates at 2.375V~2.625V volts.It is a member of the 72T series .Memory IC's maximum operating supply current is 70mA .The 72T3685 family of objects contains it.
72T3685L6-7BB Features
576K 16K x 36 memory size
72T series
Best part number of 72T3685
72T3685L6-7BB Applications
There are a lot of Renesas Electronics America Inc. 72T3685L6-7BB FIFOs Memory applications.
- Product traceability
- Data communications
- Thermal Management for DDR3 Memory Modules
- SPD for DDR3 Memory Modules
- Application that requires re-writable nonvolatile parameter memory
- Networking
- PC peripheral
- Industrial Systems
- SPI Bus Flash Memory Devices
- Tape controllers