| Parameters |
| Factory Lead Time |
12 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
240-BGA |
| Operating Temperature |
-40°C~85°C |
| Packaging |
Tray |
| Series |
72T |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Voltage - Supply |
2.375V~2.625V |
| Base Part Number |
72T36105 |
| Function |
Asynchronous, Synchronous |
| Current - Supply (Max) |
90mA |
| Memory Size |
2.25M 64K x 36 |
| Access Time |
10ns, 3.6ns |
| Data Rate |
83MHz, 200MHz |
| Bus Directional |
Uni-Directional |
| FWFT Support |
Yes |
| Expansion Type |
Depth, Width |
| RoHS Status |
Non-RoHS Compliant |
72T36105L5BBI Overview
You can find FIFO memory chip in the 240-BGA package.Tray case is used for packaging.Apps and data can be stored in the 2.25M 64K x 36 memory of the FIFO chip.Reliable operation requires a temperature of -40°C~85°C .There is a mounting type of Surface Mount on the FIFO memory.To operate, the FIFO products requires a voltage supply of 2.375V~2.625V .The 72T series comprises this memory logic.It has a maximum operating supply current of 90mA .This object belongs to the family 72T36105 .
72T36105L5BBI Features
2.25M 64K x 36 memory size
72T series
Best part number of 72T36105
72T36105L5BBI Applications
There are a lot of Renesas Electronics America Inc. 72T36105L5BBI FIFOs Memory applications.
- TVs
- Portable Information Devices
- Consumer
- High-speed graphics pixel buffer
- Down-Hole Energy Drilling
- Extended product life cycle
- Portable Information Devices
- Seismic Data Collection at Extreme Temperatures
- Analog-to-digital converters
- Computers