| Parameters |
| Factory Lead Time |
12 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
240-BGA |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Series |
72T |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Voltage - Supply |
2.375V~2.625V |
| Base Part Number |
72T18115 |
| Function |
Asynchronous, Synchronous |
| Current - Supply (Max) |
70mA |
| Memory Size |
4.5M 256K x 18 512K x 9 |
| Access Time |
12ns, 3.8ns |
| Data Rate |
66MHz, 150MHz |
| Bus Directional |
Uni-Directional |
| FWFT Support |
Yes |
| Expansion Type |
Depth, Width |
| RoHS Status |
Non-RoHS Compliant |
72T18115L6-7BB Overview
This package is included in 240-BGA .It comes in a Tray package.In addition, the FIFO chip has a memory capacity of 4.5M 256K x 18 512K x 9 , which can be used to store applications and data.The temperature should be adjusted to 0°C~70°C in order to ensure reliable operation.There is a mounting type of Surface Mount on the FIFO memory.To operate, the FIFO products requires a voltage supply of 2.375V~2.625V .The 72T series comprises this memory logic.There is a FIFO's maximum operating supply current of 70mA .Memory IC is a member of the 72T18115 family.
72T18115L6-7BB Features
4.5M 256K x 18 512K x 9 memory size
72T series
Best part number of 72T18115
72T18115L6-7BB Applications
There are a lot of Renesas Electronics America Inc. 72T18115L6-7BB FIFOs Memory applications.
- Portable Information Devices
- Test site
- Thermal Management for DDR3 Memory Modules
- Programmable Logic Controller
- SPI Bus Flash Memory Device
- Data
- Event Recorder
- Fabrication Site
- Optical memories
- Game Controller