| Parameters |
| Factory Lead Time |
7 Weeks |
| Contact Plating |
Tin |
| Mount |
Surface Mount |
| Package / Case |
LQFP |
| Number of Pins |
120 |
| Packaging |
Tape & Reel |
| Published |
2009 |
| Part Status |
Active |
| Max Operating Temperature |
85°C |
| Min Operating Temperature |
-40°C |
| Operating Supply Voltage |
5V |
| Number of Circuits |
1 |
| Max Supply Voltage |
5.5V |
| Min Supply Voltage |
4.5V |
| Memory Size |
9kB |
| Element Configuration |
Dual |
| Max Supply Current |
400μA |
| Frequency (Max) |
50MHz |
| Access Time |
13 ns |
| Data Bus Width |
36b |
| Direction |
Bidirectional |
| Bus Directional |
Bidirectional |
| Retransmit Capability |
Yes |
| FWFT Support |
Yes |
| Programmable Flags Support |
Yes |
| Length |
14mm |
| Width |
14mm |
| Thickness |
1.4mm |
| RoHS Status |
RoHS Compliant |
| Lead Free |
Lead Free |
723651L20PFGI8 Overview
FIFO memory chip is contained in the LQFP package.You'll find it packaged in the shape of a Tape & Reel .A FIFO chip's memory is 9kB , which may be used to store applications and data.Surface Mount is memory IC's recommended mounting method.The operation pins are 120 pins.In order for FIFO design to operate, FIFO design requires a maximum current of 400μA .FIFO is recommended that the supply voltage be set to 5V in order to maximize efficiency.To ensure reliabilFIFOy, FIFO runs at a minimum working temperature of -40°C degrees Celsius.Keeping the operating temperature at 85°C °C allows the FIFO products to operate continuously.It is possible to operate the FIFO memory chip at very low supply voltages, such as 4.5V volts.A maximum supply voltage of 5.5V V can be handled by this FIFO memory chip.50MHz is the FIFO memory IC's maximum value for regular operation.Using 1 circuits gives FIFO memory chip enhanced flexibility.
723651L20PFGI8 Features
9kB memory size
Frequency at most
723651L20PFGI8 Applications
There are a lot of Integrated Device Technology (IDT) 723651L20PFGI8 FIFOs Memory applications.
- Measurement Equipment
- Battery Charger
- Network switching/routing
- Disk Controllers
- Communications Systems
- Thermal Management for DDR3 Memory Modules
- Microprogramming
- Test Equipment
- Cardiac Monitoring Device
- General Data Collection Applications at Extreme High-Temperatures