7203L20TDB
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Mounting Type | Through Hole |
| Package / Case | 28-CDIP (0.300, 7.62mm) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 4.5V~5.5V |
| Base Part Number | 7203 |
| Function | Asynchronous |
| Current - Supply (Max) | 150mA |
| Memory Size | 18K 2K x 9 |
| Access Time | 20ns |
| Data Rate | 33.3MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| Programmable Flags Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
7203L20TDB Overview
This package is included in 28-CDIP (0.300, 7.62mm) .This FIFO memory chip is packaged as a Tube .There is a memory of 18K 2K x 9 on the FIFO chip that can be used to store applications and data.Regulating the temperature to -55°C~125°C ensures reliable operation.There is a mounting type of Through Hole on the FIFO memory.Operating voltage is 4.5V~5.5V .The 7200 series contains this memory logic.Memory IC's maximum operating supply current is 150mA .The 7203 family of integers consists of this type.
7203L20TDB Features
18K 2K x 9 memory size
7200 series
Best part number of 7203
7203L20TDB Applications
There are a lot of Renesas Electronics America Inc. 7203L20TDB FIFOs Memory applications.
- Networking
- Controlled baseline
- Event Recorder
- Video Processing
- Communications Systems
- Address mapping
- Thermal Management for DDR3 Memory Modules
- Industrial Systems
- Data communications
- Multimedia