68-PGM11032-10T
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 100 |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -55°C~105°C |
| Packaging | Bulk |
| Published | 2008 |
| Series | PGM |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | PGA |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -55°C |
| Contact Finish - Mating | Tin |
| Current Rating (Amps) | 3A |
| Current Rating | 3A |
| Pitch - Mating | 0.100 2.54mm |
| Contact Finish - Post | Tin |
| Lead Length | 4.191mm |
| Termination Post Length | 0.165 4.19mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 200.0μin 5.08μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
See Relate Datesheet