67SLH060080080PI00
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Hourglass |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.315 8.00mm |
| Length | 0.315 8.00mm |
| Width | 0.236 6.00mm |
| Thickness | 8.001mm |
| RoHS Status | RoHS Compliant |
67SLH060080080PI00 Overview
Contact RFI consists of materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).If the EMI/RFI is set to -40°C~70°C, it will work normally.The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.Running the contacter RFI at 158°C is ideal.The contacter RFI type is Film Over Foam.As you can see, this RFI EMI comes from the well-known SMD Grounding Metallized series of products.
67SLH060080080PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLH060080080PI00 Applications
There are a lot of Laird Technologies EMI 67SLH060080080PI00 RFI and EMI Contacts applications.
- Health care
- LoT applications
- Industrial Logger
- Internet of Things
- Digital Remote
- Receive
- Low Noise Amplifier
- Power Amplifier
- Utility Energy