614-93-320-31-012000

614-93-320-31-012000

CONN IC DIP SOCKET 20POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Origchip NO: 520-614-93-320-31-012000
  • Package: -
  • Datasheet: -
  • Stock: 591
  • Description: CONN IC DIP SOCKET 20POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Through Hole
Number of Pins 20
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2011
Series 614
JESD-609 Code e0
Feature Carrier, Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Rows 2
Additional Feature DIP SOCKET
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 10.1mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 20
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.136 3.45mm
Pitch - Post 0.100 2.54mm
Height 2.79mm
Length 25.3mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good