Parameters | |
---|---|
Factory Lead Time | 3 Weeks |
Mount | Through Hole |
Mounting Type | Through Hole |
Number of Pins | 20 |
Insulation Material | Polychlorinated |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Number of Positions or Pins (Grid) | 20 (2 x 10) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass Alloy |
Operating Temperature | -55°C~125°C |
Packaging | Tube |
Published | 2011 |
Series | 614 |
JESD-609 Code | e0 |
Feature | Carrier, Open Frame |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.3 (7.62mm) Row Spacing |
Number of Rows | 2 |
Additional Feature | DIP SOCKET |
HTS Code | 8536.90.40.00 |
Voltage - Rated DC | 150V |
Contact Finish - Mating | Gold |
Orientation | Straight |
Depth | 10.1mm |
Current Rating | 3A |
Pitch - Mating | 0.100 2.54mm |
Voltage - Rated AC | 100V |
Lead Pitch | 2.54mm |
Number of Contacts | 20 |
Contact Finish - Post | Tin-Lead |
Contact Resistance | 10mOhm |
Insulation Resistance | 10GOhm |
Row Spacing | 7.62 mm |
Termination Post Length | 0.136 3.45mm |
Pitch - Post | 0.100 2.54mm |
Height | 2.79mm |
Length | 25.3mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |