 
    | Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks | 
| Contact Material | Copper | 
| Contact Plating | Gold | 
| Insulation Material | Polychlorinated | 
| Housing Material | PLASTIC | 
| JESD-609 Code | e3 | 
| Pbfree Code | yes | 
| Part Status | Active | 
| ECCN Code | EAR99 | 
| Max Operating Temperature | 125°C | 
| Min Operating Temperature | -55°C | 
| Number of Rows | 2 | 
| Additional Feature | DIP SOCKET | 
| HTS Code | 8536.90.40.00 | 
| Voltage - Rated DC | 150V | 
| Pitch | 2.54mm | 
| Orientation | Straight | 
| Depth | 10.1mm | 
| Current Rating | 3A | 
| Voltage - Rated AC | 100V | 
| Number of Contacts | 28 | 
| Contact Resistance | 10mOhm | 
| Insulation Resistance | 10GOhm | 
| Row Spacing | 7.62 mm | 
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier | 
| Device Socket Type | IC SOCKET | 
| Length | 35.5mm | 
| RoHS Status | ROHS3 Compliant |