| Parameters | |
|---|---|
| Color | Black |
| Attachment Method | Clip, Thermal Material |
| Height Off Base (Height of Fin) | 0.500 12.70mm |
| Thermal Resistance @ Forced Air Flow | 2.50°C/W @ 250 LFM |
| Natural Thermal Resistance | 2.5 °C/W |
| Height | 12.7mm |
| Length | 2.895 73.53mm |
| Width | 2.000 50.80mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 12 Weeks |
| Mount | Clip |
| Package / Case | BGA |
| Material | Aluminum |
| Shape | Rectangular, Pin Fins |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Material Finish | Black Anodized |
| Packaging | Bulk |
| Published | 2008 |
| Series | 609 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |