| Parameters | |
|---|---|
| Contact Material | Copper |
| Contact Plating | Gold, Tin |
| Mount | Through Hole |
| Housing Material | Thermoplastic |
| Package Accepted | 8-DIP, 4 Lead (Half Size) |
| Published | 2000 |
| Series | 500 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Through Hole |
| ECCN Code | EAR99 |
| Connector Type | Pin |
| Number of Positions | 8 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 2.54mm |
| Orientation | Straight |
| Current Rating | 3A |
| Number of Contacts | 4 |
| Lead Length | 2.79mm |
| Contact Style | Screw |
| Contact Resistance | 10mOhm |
| Insulation Resistance | 5GOhm |
| Row Spacing | 7.62 mm |
| ELV | Compliant |
| Accessory Type | Socket, Full Size |
| Contact Current Rating | 3A |
| Circuit Application | Signal |
| Device Socket Type | IC SOCKET |
| Length | 17.78mm |
| Plating Thickness | 635 nm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) |