573300D00000G
| Parameters | |
|---|---|
| Thermal Resistance @ Natural | 18.00°C/W |
| Power Dissipation @ Temperature Rise | 1.3W @ 30°C |
| Height | 10.16mm |
| Length | 0.500 12.70mm |
| Width | 1.030 26.16mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 7 Weeks |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | TO-263 |
| Material | Aluminum |
| Shape | Rectangular, Fins |
| Package Cooled | TO-263 (D2Pak) |
| Material Finish | Tin |
| Packaging | Box |
| Published | 2007 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Top Mount |
| Depth | 12.7mm |
| Attachment Method | SMD Pad |
| Height Off Base (Height of Fin) | 0.400 10.16mm |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 300 LFM |
See Relate Datesheet