558-10-192M16-001104

558-10-192M16-001104

BGA SURFACE MOUNT 1.27MM


  • Manufacturer: Preci-Dip
  • Origchip NO: 620-558-10-192M16-001104
  • Package: -
  • Datasheet: PDF
  • Stock: 259
  • Description: BGA SURFACE MOUNT 1.27MM (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Housing Material FR4 Epoxy Glass
Number of Positions or Pins (Grid) 192 (16 x 16)
Contact Material - Mating Brass
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 558
Feature Closed Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type BGA
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch - Mating 0.050 1.27mm
Contact Resistance 10mOhm
Termination Post Length 0.086 2.20mm
Pitch - Post 0.050 1.27mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
See Relate Datesheet

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