 
    | Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks | 
| Contact Material | NOT SPECIFIED | 
| Housing Material | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | 
| Mounting Style | STRAIGHT | 
| JESD-609 Code | e4 | 
| Pbfree Code | yes | 
| Part Status | Active | 
| ECCN Code | EAR99 | 
| Additional Feature | PGA SOCKET | 
| HTS Code | 8536.90.40.00 | 
| Contact Finish - Mating | GOLD (30) OVER NICKEL (100) | 
| Terminal Pitch | 2.54mm | 
| Current Rating | 1A | 
| Body Length or Diameter | 1.6 inch | 
| Number of Contacts | 175 | 
| PCB Contact Pattern | RECTANGULAR | 
| Operating Temperature (Max) | 125°C | 
| Body Breadth | 1.6 inch | 
| Operating Temperature (Min) | -55°C | 
| Body Depth | 0.193 inch | 
| Contact Style | RND PIN-SKT | 
| Insulation Resistance | 10000000000Ohm | 
| Mating Contact Pitch | 0.1 inch | 
| Termination Type | WIRE WRAP | 
| Dielectric Withstanding Voltage | 1000VAC V | 
| PCB Contact Row Spacing | 0.1 mm | 
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier | 
| Device Socket Type | IC SOCKET | 
| Device Type Used On | PGA175 | 
| Contact Configuration | 16X16 | 
| RoHS Status | ROHS3 Compliant |