520-AG12D-ES-LF

520-AG12D-ES-LF

CONN IC DIP SOCKET 20POS TIN


Details

Tags

Parameters
Factory Lead Time 13 Weeks
Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Beryllium Copper
Contact Material - Post Nickel
Operating Temperature -55°C~105°C
Packaging Tube
Published 2005
Series 500
Feature Closed Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Contact Finish - Mating Tin
Pitch - Mating 0.100 2.54mm
Contact Resistance 10mOhm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
See Relate Datesheet

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