515-93-052-09-045001
| Parameters | |
|---|---|
| Termination Type | SOLDER |
| Dielectric Withstanding Voltage | 1000VAC V |
| PCB Contact Row Spacing | 0.1 mm |
| Contact Finish Termination | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
| Device Socket Type | IC SOCKET |
| Device Type Used On | PGA52 |
| Contact Configuration | 9X9 |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 3 Weeks |
| Contact Material | NOT SPECIFIED |
| Housing Material | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER |
| Mounting Style | STRAIGHT |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Active |
| ECCN Code | EAR99 |
| Additional Feature | LOW PROFILE |
| HTS Code | 8536.90.40.00 |
| Contact Finish - Mating | GOLD (30) OVER NICKEL (100) |
| Terminal Pitch | 2.54mm |
| Current Rating | 1A |
| Body Length or Diameter | 0.9 inch |
| Number of Contacts | 52 |
| PCB Contact Pattern | RECTANGULAR |
| Operating Temperature (Max) | 125°C |
| Body Breadth | 0.9 inch |
| Operating Temperature (Min) | -55°C |
| Body Depth | 0.122 inch |
| Contact Style | RND PIN-SKT |
| Insulation Resistance | 10000000000Ohm |
| Mating Contact Pitch | 0.1 inch |
See Relate Datesheet