514-83-560M33-001148
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Mounting Type | Surface Mount |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Number of Positions or Pins (Grid) | 560 (33 x 33) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2012 |
| Series | 514 |
| Feature | Open Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | BGA |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Contact Finish - Post | Tin |
| Contact Resistance | 10mOhm |
| Termination Post Length | 0.055 1.40mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 29.5μin 0.75μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet