| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Number of Pins | 253 |
| Published | 2015 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 |
| Number of Terminations | 253 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.2V |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 253 |
| Interface IC Type | INTERFACE CIRCUIT |
| Length | 13.5mm |
| Width | 8mm |
| Thickness | 1.4mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |