4900P-250G
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Published | 2014 |
| Series | 4900 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Shelf Life | 24 Months |
| Storage/Refrigeration Temperature | 35°F~50°F 2°C~10°C |
| Shelf Life Start | Date of Manufacture |
| Form | Jar, 8.8 oz (250g) |
| Process | Lead Free |
| Melting Point | 423°F~430°F 217°C~221°C |
| Flux Type | No-Clean |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet