 
    | Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks | 
| Mounting Type | Through Hole | 
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | 
| Number of Positions or Pins (Grid) | 40 (2 x 20) | 
| Contact Material - Mating | Beryllium Copper | 
| Contact Material - Post | Beryllium Copper | 
| Packaging | Bulk | 
| Published | 2013 | 
| Series | 55 | 
| JESD-609 Code | e3 | 
| Feature | Closed Frame | 
| Pbfree Code | yes | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Termination | Solder | 
| ECCN Code | EAR99 | 
| Type | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 
| Additional Feature | STANDARD: UL 94V-0 | 
| Contact Finish - Mating | Tin | 
| Current Rating (Amps) | 1A | 
| Pitch - Mating | 0.100 2.54mm | 
| Number of Contacts | 40 | 
| Termination Post Length | 0.110 2.78mm | 
| Pitch - Post | 0.100 2.54mm | 
| Contact Finish Thickness - Mating | 200.0μin 5.08μm | 
| Contact Finish Thickness - Post | 200.0μin 5.08μm | 
| Material Flammability Rating | UL94 V-0 | 
| RoHS Status | ROHS3 Compliant |