397952

397952

HMP 366 3% .022DIA. 23AWG


  • Manufacturer: Multicore
  • Origchip NO: 339-397952
  • Package: -
  • Datasheet: PDF
  • Stock: 510
  • Description: HMP 366 3% .022DIA. 23AWG (Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Weight 0.551lb 249.93g
Packaging Spool
Published 2000
Series 366
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Wire Solder
Composition Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Wire Gauge 23 AWG, 24 SWG
Wire/Cable Gauge 23 AWG
Form Spool, 8.8 oz (250g)
Process Leaded
Melting Point 565°F~574°F 296°C~301°C
Flux Type Rosin Activated (RA)
Diameter 0.022 0.56mm
RoHS Status Non-RoHS Compliant
See Relate Datesheet

Write a review

Note: HTML is not translated!
    Bad           Good