387003026

387003026

THERMOELECTRIC MODULE HI TEMP


  • Manufacturer: Laird Thermal Systems, Inc.
  • Origchip NO: 478-387003026
  • Package: -
  • Datasheet: -
  • Stock: 831
  • Description: THERMOELECTRIC MODULE HI TEMP (Kg)

Details

Tags

Parameters
Size / Dimension Rectangular - 28.70mm Lx25.40mm W
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Stages 1
Height 5.00mm
RoHS Status RoHS Compliant
See Relate Datesheet

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