| Parameters | |
|---|---|
| Factory Lead Time | 5 Weeks |
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Polyphenylene Sulfide (PPS) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -65°C~125°C |
| Packaging | Bulk |
| Published | 2016 |
| Series | PLS |
| Feature | Closed Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | PGA, ZIF (ZIP) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -65°C |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Current Rating | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Contact Finish - Post | Tin |
| Lead Length | 3.175mm |
| Termination Post Length | 0.125 3.18mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Flammability Rating | UL94 V-0 |