28-3554-18

28-3554-18

IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 28 PINS


  • Manufacturer: Aries Electronics
  • Origchip NO: 90-28-3554-18
  • Package: -
  • Datasheet: PDF
  • Stock: 306
  • Description: IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 28 PINS (Kg)

Details

Tags

Parameters
Factory Lead Time 6 Weeks
Contact Plating Nickel
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyetheretherketone (PEEK), Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Nickel
Contact Material - Post Beryllium Nickel
Operating Temperature -55°C~250°C
Packaging Bulk
Published 2006
Series 55
Feature Closed Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing
Number of Positions 28
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Nickel Boron
Terminal Pitch 2.54mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 1.99 inch
Number of Contacts 28
Contact Finish - Post Nickel Boron
PCB Contact Pattern RECTANGULAR
Body Breadth 0.9 inch
Lead Length 2.794mm
Body Depth 0.47 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 50.0μin 1.27μm
Contact Finish Thickness - Post 50.0μin 1.27μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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