2292BG
| Parameters | |
|---|---|
| Factory Lead Time | 9 Weeks |
| Contact Plating | Tin |
| Mount | Adhesive |
| Package / Case | Radial |
| Material | Aluminum |
| Shape | Cylindrical |
| Package Cooled | BGA |
| Material Finish | Black Anodized |
| Published | 2000 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Board Level |
| Color | Black |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 400 LFM |
| Natural Thermal Resistance | 8 °C/W |
| Power Dissipation @ Temperature Rise | 1.5W @ 40°C |
| Diameter | 0.300 7.62mm ID 1.125 28.57mm OD |
| Height | 7.62mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet