Parameters | |
---|---|
Mount | Surface Mount |
Package / Case | DPAK |
Material | Copper |
Shape | Rectangular |
Package Cooled | D2Pak (TO-263), SOL-20, SOT-223, TO-220 |
Material Finish | Tin |
Packaging | Bulk |
Published | 2001 |
Series | 217 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Top Mount |
Power Rating | 1W |
Attachment Method | SMD Pad |
Height Off Base (Height of Fin) | 0.360 9.14mm |
Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
Power Dissipation | 1W |
Thermal Resistance @ Natural | 55.00°C/W |
Power Dissipation @ Temperature Rise | 1.0W @ 55°C |
Height | 9.9mm |
Length | 0.740 18.80mm |
Width | 0.600 15.24mm |
REACH SVHC | Unknown |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |