Parameters | |
---|---|
Lead Free | Lead Free |
Factory Lead Time | 5 Weeks |
Mounting Type | Through Hole |
Package / Case | SOIC |
Number of Pins | 20 |
Contact Material - Post | Brass |
Board Material | FR4 Epoxy Glass |
Published | 2007 |
Series | Correct-A-Chip® 350000 |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Additional Feature | SOCKET ADAPTER |
Contact Finish - Mating | GOLD (10) OVER NICKEL (100) |
Pitch - Mating | 0.050 1.27mm |
Number of Contacts | 20 |
Contact Finish - Post | Tin |
Device Socket Type | IC SOCKET |
Termination Post Length | 0.125 3.18mm |
Pitch - Post | 0.100 2.54mm |
Convert From (Adapter End) | SOJ |
Convert To (Adapter End) | DIP, 0.3 (7.62mm) Row Spacing |
Height | 1.58mm |
Length | 25.4mm |
Contact Finish Thickness - Post | 200.0μin 5.08μm |
RoHS Status | ROHS3 Compliant |