2-641604-4
| Parameters | |
|---|---|
| Contact Material | Bronze |
| Mount | Vertical |
| Mounting Type | Through Hole |
| Package / Case | SOIC |
| Insulation Material | Thermoplastic |
| Housing Material | Thermoplastic, Glass Filled |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Contact Material - Mating | Phosphor Bronze |
| Contact Material - Post | Phosphor Bronze |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Published | 2005 |
| Series | Diplomate DL |
| JESD-609 Code | e0 |
| Feature | Open Frame |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Type | DIP, 0.6 (15.24mm) Row Spacing |
| Color | Black |
| Number of Rows | 2 |
| Additional Feature | STANDARD: UL 94V-0 |
| HTS Code | 8536.69.40.40 |
| Contact Finish - Mating | Gold |
| Orientation | Straight |
| Depth | 17.63mm |
| Pitch - Mating | 0.100 2.54mm |
| Lead Pitch | 2.54mm |
| Number of Contacts | 24 |
| PCB Contact Pattern | RECTANGULAR |
| Body Breadth | 0.694 inch |
| Lead Length | 3.25mm |
| Contact Style | BELLOWED TYPE |
| Contact Resistance | 30mOhm |
| Insulation Resistance | 10GOhm |
| Row Spacing | 15.49 mm |
| Mating Contact Pitch | 0.1 inch |
| ELV | Non-Compliant |
| Dielectric Withstanding Voltage | 1000VAC V |
| Data Rate | 250 kbps |
| Receiver Hysteresis | 25 mV |
| Termination Post Length | 0.128 3.24mm |
| Pitch - Post | 0.100 2.54mm |
| Simplex/Duplex | Half Duplex |
| Length | 30.35mm |
| Width | 17.63mm |
| Contact Finish Thickness - Mating | 15.0μin 0.38μm |
| Contact Finish Thickness - Post | 15.0μin 0.38μm |
| Material Flammability Rating | UL94 V-0 |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Flammability Rating | UL94 V-0 |
See Relate Datesheet