1SX250LN2F43I2VG

1SX250LN2F43I2VG

-40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O


  • Manufacturer: Intel
  • Origchip NO: 386-1SX250LN2F43I2VG
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 602
  • Description: -40°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 688
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).Assigned with the package 1760-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Stratix? 10 SX series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines FPGA - 2500K Logic Elements.This SoC system on a chip has been designed in a state-of-the-art Tray package.688 I/Os are included in this SoC part.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LN2F43I2VG System On Chip (SoC) applications.

  • Smartphone accessories
  • Personal Computers
  • Optical drive
  • Measurement tools
  • Functional safety for critical applications in the automotive
  • Automotive
  • Networked sensors
  • Video Imaging
  • Mobile market
  • Three phase UPS

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