1824750000

1824750000

1824750000 datasheet pdf and Terminal Blocks - Wire to Board product details from Weidmüller stock available at Feilidi


  • Manufacturer: Weidmüller
  • Origchip NO: 872-1824750000
  • Package: -
  • Datasheet: PDF
  • Stock: 935
  • Description: 1824750000 datasheet pdf and Terminal Blocks - Wire to Board product details from Weidmüller stock available at Feilidi (Kg)

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP), Glass Filled
Contact Material - Plating Copper Alloy - Tin Plated
Operating Temperature -50°C~240°C
Packaging Tube
Published 2009
Series Omnimate LSF-SMT
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Number of Positions 3
Color Black
Number of Rows 1
Gender Female
Voltage - Rated 300V
Additional Feature GLASS FILLED LCP, 94V-0
Pitch 0.197 5.00mm
Orientation Right Angle
Depth 14.3mm
Current Rating 17.5A
Approval Agency CSA, cURus
Wire Gauge 16-24 AWG
Max Supply Voltage 300V
Max Current Rating 10A
Number of Levels 1
Current 12A
Wire Gauge (Max) 24 AWG
Wire Gauge (Min) 16 AWG
Wire/Cable Gauge 24 AWG
Number of Decks 1
Terminal and Terminal Block Type MODULAR TERMINAL BLOCK
Number of Ways 3
Safety Approval UL; VDE; CSA
Mating Orientation Horizontal with Board
Wire Termination Screwless - Push Button Clamp
Hole Diameter 1 mm
Stripping Length 8mm
Fastening Method PUSH-ON
Length 14.2mm
Width 8.5mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
See Relate Datesheet

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