 
    | Parameters | |
|---|---|
| Contact Material | Copper | 
| Mount | Through Hole | 
| Mounting Type | Through Hole | 
| Housing Material | Aluminum Alloy | 
| Number of Positions or Pins (Grid) | 6 (2 x 3) | 
| Contact Material - Mating | Beryllium Copper | 
| Contact Material - Post | Beryllium Copper | 
| Operating Temperature | -55°C~125°C | 
| Published | 2005 | 
| Series | 700 | 
| JESD-609 Code | e0 | 
| Feature | Carrier, Closed Frame | 
| Part Status | Obsolete | 
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 
| Termination | Solder | 
| ECCN Code | EAR99 | 
| Type | DIP, 0.3 (7.62mm) Row Spacing | 
| Number of Rows | 2 | 
| Additional Feature | STANDARD PROFILE, VERTICAL MOUNT, DIP SOCKET | 
| Contact Finish - Mating | Gold | 
| Current Rating (Amps) | 3A | 
| Orientation | Straight | 
| Reach Compliance Code | unknown | 
| Pitch - Mating | 0.100 2.54mm | 
| Number of Contacts | 6 | 
| Contact Resistance | 10mOhm | 
| Termination Post Length | 0.125 3.18mm | 
| Pitch - Post | 0.100 2.54mm | 
| Height | 4.2mm | 
| Length | 7.62mm | 
| Width | 7.62mm | 
| Contact Finish Thickness - Mating | 20.0μin 0.51μm | 
| Contact Finish Thickness - Post | 20.0μin 0.51μm | 
| Material Flammability Rating | UL94 V-0 | 
| RoHS Status | RoHS Compliant | 
| Lead Free | Lead Free |