14-6501-21

14-6501-21

IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS GOLD


  • Manufacturer: Aries Electronics
  • Origchip NO: 90-14-6501-21
  • Package: -
  • Datasheet: PDF
  • Stock: 153
  • Description: IC & Component Sockets WIRE WRAP BIFURCATED 14 PINS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 7 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 14 (2 x 7)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 501
JESD-609 Code e4
Feature Closed Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Wire Wrap
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 14
Number of Rows 2
Additional Feature STANDARD: UL 94V-0
Contact Finish - Mating Gold
Current Rating 1.5A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 0.75 inch
Lead Pitch 2.54mm
Number of Contacts 14
PCB Contact Pattern RECTANGULAR
Body Breadth 0.69 inch
Lead Length 17.526mm
Body Depth 0.3 inch
Contact Style SQ PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.6 mm
Termination Post Length 0.690 17.52mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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