| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Contact Material | Copper |
| Contact Plating | Gold |
| Insulation Material | Polychlorinated |
| Housing Material | PLASTIC |
| Published | 2012 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Termination | Solder |
| ECCN Code | EAR99 |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Number of Rows | 2 |
| Additional Feature | DIP SOCKET |
| HTS Code | 8536.90.40.00 |
| Voltage - Rated DC | 150V |
| Pitch | 2.54mm |
| Orientation | Straight |
| Depth | 10.16mm |
| Current Rating | 3A |
| Number of Contacts | 6 |
| Contact Resistance | 10mOhm |
| Insulation Resistance | 10GOhm |
| Row Spacing | 7.62 mm |
| Device Socket Type | IC SOCKET |
| Device Type Used On | DIP6 |
| Length | 7.62mm |
| RoHS Status | ROHS3 Compliant |