117-93-656-41-005000

117-93-656-41-005000

CONN IC DIP SOCKET 56POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Origchip NO: 520-117-93-656-41-005000
  • Package: -
  • Datasheet: -
  • Stock: 255
  • Description: CONN IC DIP SOCKET 56POS GOLD (Kg)

Details

Tags

Parameters
Contact Material Copper
Mount Through Hole
Mounting Type Through Hole
Number of Pins 56
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 56 (2 x 28)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2011
Series 117
JESD-609 Code e0
Feature Open Frame
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Rows 2
HTS Code 8536.90.40.00
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Orientation Straight
Depth 17.53mm
Current Rating 3A
Pitch - Mating 0.070 1.78mm
Voltage - Rated AC 100V
Lead Pitch 180μm
Number of Contacts 56
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 15.24 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.070 1.78mm
Length 50.1mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Factory Lead Time 3 Weeks
See Relate Datesheet

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