110-93-648-41-001000

110-93-648-41-001000

CONN IC DIP SOCKET 48POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Origchip NO: 520-110-93-648-41-001000
  • Package: DIP
  • Datasheet: PDF
  • Stock: 504
  • Description: CONN IC DIP SOCKET 48POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 3 Weeks
Contact Material Copper
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Number of Pins 48
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Body Material PBT, Polybutylene, Polyester
Number of Positions or Pins (Grid) 48 (2 x 24)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2010
Series 110
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Positions 48
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Number of Rows 2
Voltage - Rated 1kV
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Current Rating (Amps) 3A
Pitch 2.54mm
Orientation Straight
Depth 17.7mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 48
Contact Finish - Post Tin-Lead
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 15.24 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 60.96mm
Width 17.78mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
See Relate Datesheet

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