Parameters | |
---|---|
Factory Lead Time | 10 Weeks |
Mount | Through Hole |
Mounting Type | Through Hole |
Number of Pins | 50 |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Number of Positions or Pins (Grid) | 50 (2 x 25) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Brass |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2012 |
Series | 110 |
Feature | Open Frame |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
Type | DIP, 0.9 (22.86mm) Row Spacing |
Contact Finish - Mating | Gold |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Contact Finish - Post | Tin |
Contact Resistance | 10mOhm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 29.5μin 0.75μm |
Material Flammability Rating | UL94 V-0 |
RoHS Status | ROHS3 Compliant |
Flammability Rating | UL94 V-0 |