110-13-318-41-801000

110-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD


  • Manufacturer: Mill-Max Manufacturing Corp.
  • Origchip NO: 520-110-13-318-41-801000
  • Package: DIP
  • Datasheet: -
  • Stock: 435
  • Description: CONN IC DIP SOCKET 18POS GOLD (Kg)

Details

Tags

Parameters
Factory Lead Time 3 Weeks
Contact Material Copper
Contact Plating Gold
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Number of Pins 18
Insulation Material Polychlorinated
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid) 18 (2 x 9)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass Alloy
Operating Temperature -55°C~125°C
Packaging Tube
Published 2009
Series 110
Feature Open Frame, Decoupling Capacitor
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 18
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Number of Rows 2
Voltage - Rated 1kV
Voltage - Rated DC 150V
Contact Finish - Mating Gold
Current Rating (Amps) 3A
Pitch 2.54mm
Orientation Straight
Depth 10.16mm
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 100V
Lead Pitch 2.54mm
Number of Contacts 18
Contact Finish - Post Gold
Contact Resistance 10mOhm
Insulation Resistance 10GOhm
Row Spacing 7.62 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Length 22.86mm
Width 10.16mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 10.0μin 0.25μm
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
See Relate Datesheet

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