10018784-00100TLF

10018784-00100TLF

10018784-00100TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at ORIGCHIP


  • Manufacturer: Amphenol ICC (FCI)
  • Origchip NO: 44-10018784-00100TLF
  • Package: -
  • Datasheet: PDF
  • Stock: 672
  • Description: 10018784-00100TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at ORIGCHIP(Kg)

Details

Tags

Parameters
Factory Lead Time 12 Weeks
Contact Material Copper Alloy
Contact Plating GXT, Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Nylon
Material - Insulation Polyamide (PA), Nylon, Glass Filled
Operating Temperature -55°C~85°C
Packaging Tray
Feature Board Guide, Locking Ramp
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
Number of Positions 36
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Color White
Number of Rows 2
Gender Female
Pitch 0.039 1.00mm
Orientation Straight
Contact Finish Gold or Gold, GXT™
Housing Color White
Card Type PCI Express™
Read Out Dual
Max Voltage Rating (AC) 300V
Contact Finish Thickness 15.0μin 0.38μm
Card Thickness 0.062 1.57mm
RoHS Status RoHS Compliant

10018784-00100TLF Overview


Materials were packaged according to Tray's specs.It's recommended to mount type Through Hole.Board Guide, Locking Ramp features are present on the device.A temperature of 85°C°C is the maximum operating temperature.For reliability, it needs to be at -55°C degrees Celsius.

10018784-00100TLF Features



10018784-00100TLF Applications


There are a lot of Amphenol ICC (FCI) 10018784-00100TLF Edgeboard Connectors applications.

  • GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
  • Handheld Terminal Interface
  • Battery Operated Systems
  • Industrial Process Control
  • Instrumentation and test equipment
  • Communication test equipment
  • Wireless and wired broadband communications
  • Medical Imaging
  • Music recording
  • Imaging Systems

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