| Parameters |
| Factory Lead Time |
10 Weeks |
| Contact Material |
Copper Alloy |
| Contact Plating |
Gold |
| Mount |
Through Hole |
| Mounting Type |
Through Hole |
| Housing Material |
Nylon |
| Material - Insulation |
Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature |
-55°C~85°C |
| Packaging |
Tray |
| Published |
2015 |
| Series |
HPCE® |
| Feature |
Board Guide, Locking Ramp |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| Termination |
Solder, Staggered |
| Connector Type |
Cantilever |
| Number of Positions |
64 |
| Max Operating Temperature |
85°C |
| Min Operating Temperature |
-55°C |
| Color |
Black |
| Number of Rows |
2 |
| Gender |
Female |
| Contact Type |
Cantilever |
| Pitch |
0.039 1.00mm |
| Orientation |
Straight |
| Current Rating |
1.1A |
| Contact Finish |
Gold |
| Voltage - Rated AC |
300V |
| Number of Contacts |
64 |
| Housing Color |
Black |
| Contact Resistance |
40mOhm |
| Card Type |
PCI Express™ |
| Read Out |
Dual |
| Insulation Resistance |
1GOhm |
| Number of Positions/Bay/Row |
11; 21 |
| Max Voltage Rating (AC) |
300V |
| Length |
39mm |
| Width |
7.4mm |
| Contact Finish Thickness |
15.0μin 0.38μm |
| Card Thickness |
0.062 1.57mm |
| Board Thickness |
2.36mm |
| RoHS Status |
RoHS Compliant |
| Flammability Rating |
UL94 V-0 |
| Lead Free |
Lead Free |
10018783-10111TLF Overview
In accordance with Tray's specifications, the material was packaged.It's best to mount type Through Hole.This device is connected through the connector socket Cantilever.Features: Board Guide, Locking Ramp.A HPCE? means the device is a series device.For stable operation, keep it at 85°C°C.The device must maintain a minimum working temperature of -55°C degrees Celsius in order to ensure its reliability.
10018783-10111TLF Features
HPCE? series
10018783-10111TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10111TLF Edgeboard Connectors applications.
- Communications
- Automotive
- Imaging Systems
- AC motor control
- Digital beam-forming systems for ultrasound
- Music reproduction technology
- Rotary encoder
- Digital signal processing
- Multiplexed Data Acquisition Systems
- High Speed Data Acquisition