10018783-10103TLF
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Mount | Through Hole, Vertical |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
| Operating Temperature | -55°C~85°C |
| Packaging | Tray |
| Series | HPCE® |
| Feature | Board Guide, Locking Ramp |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | Cantilever |
| Number of Positions | 164 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Contact Type | Cantilever |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| Voltage - Rated AC | 300V |
| Lead Pitch | 2mm |
| Number of Contacts | 164 |
| Housing Color | Black |
| Contact Resistance | 30mOhm |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Insulation Resistance | 1GOhm |
| Max Voltage Rating (AC) | 300V |
| Length | 89mm |
| Width | 7.4mm |
| Contact Finish Thickness | 15.0μin 0.38μm |
| Card Thickness | 0.062 1.57mm |
| Board Thickness | 1.56mm |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
| Lead Free | Lead Free |
10018783-10103TLF Overview
In accordance with Tray's specifications, the material was packaged.It's best to mount type Through Hole.Connecting the device is accomplished through the connector socket Cantilever.Features: Board Guide, Locking Ramp.The HPCE? indicates the series number of the device.Operating temperatures of 85°C°C provide stable performance.It needs a minimum working temperature of -55°C degrees Celsius to work.
10018783-10103TLF Features
HPCE? series
10018783-10103TLF Applications
There are a lot of Amphenol ICC (FCI) 10018783-10103TLF Edgeboard Connectors applications.
- Displaying
- Digital beam-forming systems for ultrasound
- Smart antenna systems
- Battery Operated Systems
- Multiplexed Data Acquisition Systems
- Uninterrupted Power Supplies
- Telecommunications
- Music reproduction technology
- Communications
- Communication Systems