10018783-10010MLF

10018783-10010MLF

10018783-10010MLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at ORIGCHIP


  • Manufacturer: Amphenol ICC (FCI)
  • Origchip NO: 44-10018783-10010MLF
  • Package: -
  • Datasheet: PDF
  • Stock: 535
  • Description: 10018783-10010MLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at ORIGCHIP(Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Contact Material Copper Alloy
Contact Plating GXT, Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Nylon
Material - Insulation Polyamide (PA), Nylon, Glass Filled
Operating Temperature -55°C~85°C
Packaging Tray
Feature Board Guide, Locking Ramp
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
Number of Positions 36
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2
Gender Female
Pitch 0.039 1.00mm
Orientation Straight
Current Rating 1.1A
Contact Finish Gold or Gold, GXT™
Voltage - Rated AC 300V
Housing Color Black
Card Type PCI Express™
Read Out Dual
Insulation Resistance 1GOhm
Max Voltage Rating (AC) 300V
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.093 2.36mm
Board Thickness 2.36mm
RoHS Status RoHS Compliant

10018783-10010MLF Overview


Packaging was done per Tray's specs.It is recommended to mount the device using mounting type Through Hole.Feature-wise, the device has Board Guide, Locking Ramp.An operating temperature of [0°C] ensures stable operation.In order to ensure that it is reliable, it must operate at a minimum temperature of -55°C degrees Celsius.

10018783-10010MLF Features



10018783-10010MLF Applications


There are a lot of Amphenol ICC (FCI) 10018783-10010MLF Edgeboard Connectors applications.

  • Digital Multimeters, PLC's (Programming Logic Controllers)
  • Displaying
  • Instrumentation and test equipment
  • Transducer
  • CMOS Image sensors for mobile applications
  • Medical Instrumentation and medical imaging
  • Battery Operated Systems
  • Music recording
  • 3-phase power control
  • Microcontrollers.

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