0877159107
| Parameters | |
|---|---|
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Packaging | Tray |
| Series | 87715 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Locking Ramp |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | POLARIZED |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Cantilever |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Total Number of Contacts | 64 |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| UL Flammability Code | 94V-0 |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Max Voltage Rating (AC) | 50V |
| Max Voltage Rating (DC) | 50V |
| Contact Finish Thickness | Flash |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
0877159107 Overview
Packaging was done to Tray's specifications.It is recommended to use mounting type Through Hole.The device is connected by using the connector socket CARD EDGE CONNECTOR.There are Board Guide, Locking Ramp features on the device.Device series 87715 is indicated by the 87715.It is important to note that this chip has the following additional features: POLARIZEDFor stable operation, a maximum operating temperature of 85°C°C should be considered.It needs a minimum working temperature of -55°C degrees Celsius.
0877159107 Features
87715 series
0877159107 Applications
There are a lot of Molex 0877159107 Edgeboard Connectors applications.
- Scientific instruments
- 3-phase power control
- Multiplexed Data Acquisition Systems
- Medical Instrumentation and medical imaging
- Industrial Process Control
- Communications
- Cell Phones
- Digital beam-forming systems for ultrasound
- Multicarrier, multimode digital receivers
- In-building wireless telephony