0877159101
| Parameters | |
|---|---|
| Contact Material | Phosphor Bronze |
| Contact Plating | Gold, Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Housing Material | Nylon |
| Material - Insulation | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Packaging | Tray |
| Series | 87715 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Locking Ramp |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder, Staggered |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 64 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -55°C |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | POLARIZED |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Cantilever |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Total Number of Contacts | 64 |
| Orientation | Straight |
| Current Rating | 1.1A |
| Contact Finish | Gold |
| UL Flammability Code | 94V-0 |
| Card Type | PCI Express™ |
| Read Out | Dual |
| Max Voltage Rating (AC) | 50V |
| Max Voltage Rating (DC) | 50V |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
0877159101 Overview
Packaging was conducted in accordance with Tray's specifications.It's recommended to mount type Through Hole.The device is connected via the connector socket CARD EDGE CONNECTOR.Board Guide, Locking Ramp features are included in the device.87715 tells you the series of the device.The following additional features are included in this chip: POLARIZEDStable operation requires 85°C°C as the max operating temperature.The device must be kept at a temperature of -55°C degrees Celsius in order to be reliable.
0877159101 Features
87715 series
0877159101 Applications
There are a lot of Molex 0877159101 Edgeboard Connectors applications.
- Wireless local loop
- 4-channel data acquisition
- Communications
- Microcontrollers.
- Data Acquisition Systems
- Audio/Video devices
- Handheld Terminal Interface
- CMOS Image sensors for mobile applications
- Telecommunications
- Communication Systems