XCZU6CG-1FFVC900I
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 900-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 204 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The Zynq? UltraScale+? MPSoC CG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells and that is something to note.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 204 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6CG-1FFVC900I System On Chip (SoC) applications.
- Industrial automation devices
- Three phase UPS
- Defense
- Industrial sectors
- Body control module
- System-on-chip (SoC)
- Industrial robot
- Microprocessors
- Mobile computing
- Optical drive