| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            784-BFBGA, FCBGA | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Published | 
                                            2016 | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EV | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Number of I/O | 
                                            252 | 
                                        
                                                                            
                                            | Speed | 
                                            500MHz, 600MHz, 1.2GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            256KB | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
                                        
                                                                            
                                            | Architecture | 
                                            MCU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.Manufacturer assigns package 784-BFBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EV.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 252 I/Os.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc. 
XCZU5EV-1SFVC784I System On Chip (SoC) applications. 
- Cyber security for critical applications in the aerospace
 - Avionics 
 - PC peripherals 
 - Self-aware system-on-chip (SoC)
 - Mouse 
 - Multiprocessor system-on-chips (MPSoCs)
 - Vending machines
 - Automotive 
 - Smartphones
 - Automotive gateway