| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            784-BFBGA, FCBGA | 
                                        
                                                                            
                                            | Supplier Device Package | 
                                            784-FCBGA (23x23) | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            0°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Published | 
                                            2016 | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EV | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | Number of I/O | 
                                            252 | 
                                        
                                                                            
                                            | Speed | 
                                            500MHz, 600MHz, 1.2GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            256KB | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
                                        
                                                                            
                                            | Architecture | 
                                            MCU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.In the Zynq? UltraScale+? MPSoC EV series, this system on chip SoC is included.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.252 I/Os are available in this SoC part.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc. 
XCZU5EV-1SFVC784E System On Chip (SoC) applications. 
- AC-input BLDC motor drive
 - String inverter
 - PC peripherals 
 - Transmitters
 - Industrial sectors
 - Body control module
 - Optical drive
 - Multiprocessor system-on-chips (MPSoCs)
 - Apple smart watch
 - Published Paper