| Parameters | 
                                
                                                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Technology | 
                                            CMOS | 
                                        
                                                                            
                                            | Terminal Position | 
                                            BOTTOM | 
                                        
                                                                            
                                            | Terminal Form | 
                                            BALL | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | Supply Voltage | 
                                            0.72V | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            NOT SPECIFIED | 
                                        
                                                                            
                                            | JESD-30 Code | 
                                            R-PBGA-B625 | 
                                        
                                                                            
                                            | Supply Voltage-Max (Vsup) | 
                                            0.742V | 
                                        
                                                                            
                                            | Supply Voltage-Min (Vsup) | 
                                            0.698V | 
                                        
                                                                            
                                            | Number of I/O | 
                                            180 | 
                                        
                                                                            
                                            | Speed | 
                                            500MHz, 600MHz, 1.2GHz | 
                                        
                                                                            
                                            | RAM Size | 
                                            256KB | 
                                        
                                                                            
                                            | uPs/uCs/Peripheral ICs Type | 
                                            MICROPROCESSOR CIRCUIT | 
                                        
                                                                            
                                            | Core Processor | 
                                            Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 
                                        
                                                                            
                                            | Peripherals | 
                                            DMA, WDT | 
                                        
                                                                            
                                            | Connectivity | 
                                            CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 
                                        
                                                                            
                                            | Architecture | 
                                            MCU, FPGA | 
                                        
                                                                            
                                            | Primary Attributes | 
                                            Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                            
                                            | Factory Lead Time | 
                                            11 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            625-BFBGA, FCBGA | 
                                        
                                                                            
                                            | Surface Mount | 
                                            YES | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~100°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Series | 
                                            Zynq® UltraScale+™ MPSoC EG | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            4 (72 Hours) | 
                                        
                                                                            
                                            | Number of Terminations | 
                                            625 | 
                                        
                                                                            
                                            | Additional Feature | 
                                            ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 
                                        
                                                                                                    
                            
                         
                                                This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 625-BFBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.180 I/Os in total are included in this SoC part.It is recommended to use a 0.72V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.In total, there are 625 terminations, which makes system on a chip possible.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.Additionally, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc. 
XCZU2EG-L1SFVA625I System On Chip (SoC) applications. 
- Robotics
 - Industrial AC-DC
 - Cyberphysical system-on-chip
 - USB hard disk enclosure
 - AC-input BLDC motor drive
 - AC drive control module
 - Servo drive control module
 - Special Issue Information
 - Mobile computing
 - PC peripherals